Resin bonded Diamond Back Grinding Wheel for Silicon Wafer thinning

🍀Resin-bonded Diamond Back Grinding Wheel for Silicon Wafer thinning
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👉Resin diamond grinding wheels are used on back grinding machines for thinning and flattening silicon wafers, glass products, ceramic products.
👉Application: back thinning, grinding and fine grinding of the sapphire epitaxial wafer, silicon wafer, gallium arsenide, and GaN wafer.
👉Sizes range from 8” to 14” O.D. Used on machines manufactured by Disco, Okamoto, Strasbaugh, and many others.
👉Grinders: SHUWA SGM-6301, NTS Nano surface-180G, NTS Nano surface 250/NC-VDM
👉Workpiece processed: silicon wafer of discrete devices and integrated chips(IC), etc.
👉The material of workpiece: monocrystalline silicon and some other semiconductor materials such as gallium arsenide and GaN materials.
👉Application: back thinning, grinding and fine grinding.
💐If need or interest feel free to contact WhatsApp:+8615093391569; julia@moresuperhard.com