Electroformed Hubless diamond dicing blades



🍀Electroformed Hubless Diamond Dicing Blade
🔹Hubless Diamond Dicing Blade is used for various cutting grooving of silicon wafers, silicon for semiconductors, compound wafers, electronic materials, resin, metals, ceramics, ceramic packages, PCB、BGA, LTCC, HTCC, compound materials, etc.
✅High abrasive content
✅High working life
✅High accuracy
#dicing #dicingblade #diamonddicingblade #hublessdicingblade #electroformeddicingblade
#silionwafer #silicon #hublessblade
If interest or need feel free to contact julia@moresuperhard.com or Whatsapp:+8615093391569
#semiconductors #electronics

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