Moresuperhardtools-Julia

🍀Resin-bonded Diamond Back Grinding Wheel for Silicon Wafer thinning hashtag # waferthinning hashtag # backgrindingwheel hashtag # siliconwaferbackgrinding 👉Resin diamond grinding wheels are used on back grinding machines for thinning and flattening silicon wafers, glass products, ceramic products. 👉Application: back thinning, grinding and fine grinding of the sapphire epitaxial wafer, silicon wafer, gallium arsenide, and GaN wafer. 👉Sizes range from 8” to 14” O.D. Used on machines manufactured by Disco, Okamoto, Strasbaugh, and many others. 👉Grinders: SHUWA SGM-6301, NTS Nano surface-180G, NTS Nano surface 250/NC-VDM 👉Workpiece processed: silicon wafer of discrete devices and integrated chips(IC), etc. 👉The material of workpiece: monocrystalline silicon and some other semiconductor materials such as gallium arsenide and GaN materials. 👉Application: back thinning, grinding and fine grinding. 💐If need or interest feel free to contact WhatsApp:+8615093391569; julia@m...

🍀 Resin Bond Diamond Grinding Wheel for PCBN Tools # diamondwheel   # resindiamondwheel   # cbntools   # diamondwheelforcbntools 👉 Our 6A2 type resin bond diamond wheel is especially for face and peripheral grinding of carbide&CBN tools~ 👉 When grinding CBN tools, resin bond diamond grinding wheel is mostly used. 👉 If the machining tolerance is big, you can use 140/170 for rough grinding,then use230/270,W35,W28 for fine grinding. 👉 If you want to save cost & time you can choose W35 for the whole grinding. If you have problems in machining CBN tool grinding, feel free to contact: Whatsapp:+8615093391569; julia@moresuperhard.com

🍀Resin bond diamond wheel for thinning and back grinding of silicon wafer #waferthinning #backgrindingwheel #siliconwaferbackgrinding 👉Resin diamond grinding wheels are used on back grinding machines for thinning and flattening silicon wafers, glass products, ceramic products. 👉Sizes range from 8” to 14” O.D. Used on machines manufactured by Disco, Okamoto, Strasbaugh, and many others. 👉Workpiece processed: silicon wafer of discrete devices and integrated chips(IC), etc. 👉Material of workpiece: monocrystalline silicon and some other semiconductor materials 👉Application: back thinning, grinding and fine grinding. 💐If need or interest feel free to contact whatsapp:+8615093391569; julia@moresuperhard.com