Resin bond diamond wheel for thinning and back grinding of silicon wafer



🍀Resin bond diamond wheel for thinning and back grinding of silicon wafer
#waferthinning #backgrindingwheel #siliconwaferbackgrinding
👉Resin diamond grinding wheels are used on back grinding machines for thinning and flattening silicon wafers, glass products, ceramic products.
👉Sizes range from 8” to 14” O.D. Used on machines manufactured by Disco, Okamoto, Strasbaugh, and many others.
👉Workpiece processed: silicon wafer of discrete devices and integrated chips(IC), etc.
👉Material of workpiece: monocrystalline silicon and some other semiconductor materials
👉Application: back thinning, grinding and fine grinding.
💐If need or interest feel free to contact whatsapp:+8615093391569; julia@moresuperhard.com

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