Resin bond diamond wheel for thinning and back grinding of silicon wafer

🍀Resin bond diamond wheel for thinning and back grinding of silicon wafer

#waferthinning #backgrindingwheel #siliconwaferbackgrinding

👉Resin diamond grinding wheels are used on back grinding machines for thinning and flattening silicon wafers, glass products, ceramic products.

👉Sizes range from 8” to 14” O.D. Used on machines manufactured by Disco, Okamoto, Strasbaugh, and many others.

👉Workpiece processed: silicon wafer of discrete devices and integrated chips(IC), etc.

👉Material of workpiece: monocrystalline silicon and some other semiconductor materials

👉Application: back thinning, grinding and fine grinding.

💐If need or interest feel free to contact whatsapp:+8615093391569; julia@moresuperhard.com